A Sensata Technologies company

Custom IC Design

Custom ICs – your route to technical and commercial advantage

SWINDON’s market leading and renowned enhanced analogue, digital, mixed-signal ASIC, MEMS and System in Package custom IC deisgn and solutions enable our partners to elevate themselves above their competition by providing technology that differentiates them from the crowd. This is achieved by providing higher performing, smaller footprint, more efficient, lower power and lower cost ASIC/MEMS/SiP solutions that are smarter, more innovative, more highly integrated, safer and easier to use.

The SWINDON team consists of Consultant, Design, Layout and Test engineers working together as a team and in partnership with our customers in a world class environment that delivers the optimum silicon solution every time. SWINDON provides all our customers with an in house full turnkey service from specification definition through to 100% wafer probe and packaged device test high volume supply.

Hover over the diagram above to view ASIC design process details

Foundry Process

SWINDON combines its own expertise with that of the world’s leading analog/mixed-signal semiconductor foundry services. By combining our market leading ASIC design and test capabilities with their specialised expertise in advanced analog and mixed signal process technologies we provide our customers with an expert and secure route to advanced product realisation.

Available modules

  • Low Power 1.8V / 5.0V CMOS Core Module (1P2M)
  • Low Power 5.0V CMOS Core Module (1P2M)
  • Isolated CMOS module
  • Depletion Transistor Module
  • Bipolar Module
  • Non-volatile Memory Module
  • Flash module
  • High Voltage CMOS & DMOS Modules
  • MIM, DMIM, TMIM Capacitor Modules
  • High Capacitance Capacitor Modules
  • Diode Modules
  • Medium Resistance Polysilicon Module
  • OTP Module
  • 3 Metals Layer Module
  • 4 Metals Layer Module
  • 5 Metals Layer Module
  • Thin Top Metal Module
  • Top Metal Module
  • Thick Metal Module
  • Polyimide Module
  • Pinned-photo Diode Modules
  • 4T pixel Module

Foundry Process Information

NameProcess DescriptionCore(V)I|OMV|HV(V)OPTONVM
55/65nmFlexibile analog mixed-signal1.2|1.8|2.53.3|5|8|12eFlash
0.13µm High flexibility analog mixed-signal1.53.3
0.18µmHigh performance mixed signal, high temperature, high-voltage and NVM1.83.36|10|15|20|40|
45
TrimOTP
eFlash
NVRAM
0.18µm

High performance analog mixed signal 1.83.3 5.0TrimOTP
PolyFuse
0.18µmPower Management1.8
5.0
5.013|15|25|30|40|
45|60
TrimOTP
PolyFuse
EEPROM
eFlash
0.18µmImage Sensor Enabled3.31.8
3.3
TrimOTP
PolyFuse
0.25µmAnalog/digital mixed signal baseline2.53.3
5.0
eFlash
0.35µmHigh performance, high voltage 3.33.3 5.012|14|18|45|55|
75|100
TrimOTP
ZenerZap
HD OTP
NV Latch
EEPROM
CEEPROM
0.35µmHigh temperature analog mixed signal3.33.3 5.012|14|18|45|55|
75|100
TrimOTP
ZenerZap
EEPROM
CEEPROM
0.35µmHigh speed opto3.33.3
5.0
12PolyFuse
ZenerZap
0.35µmUltra-High-Voltage5.05.020|40|700ZenerZap

Memory Options

Memory OptionsTypical SizeData RetentionEndurance
SRAM64-512kbits
Trim Registers
Bit Writeable OTP1 - 128 bits

10 Years @ 85˚C10k Cycles
Bit R/W 1 - 128bits
Word Writeable OTP8bit - 2kbit
Application Memory
OTP1kbit, 64kbit, 256kbit10 Years @ 85˚C1k Cycles @ 85˚C
EEPROM32bit – 32kbit10 Years @ 125˚C100k Cycles
CEEPROM
(Fast access and lower power)
32bit – 4kbit10 Years @ 125˚C100k Cycles
FLASH32kbit – 1Mbit20 Years @ 85˚C1k Cycles @ 85˚C
NVRAM1kbit – 16kbit10 Years @ 125˚C10k Cycles

ASIC Packaging

SWINDON offers, through our world renowned packaging partners a broad range of standard and custom Leadframe, Leadless and Laminate packages with pin counts ranging from 3 to 484+. Also offered are WLCSPs or Wafer-Level Chip-Scale Packages which is a low cost solution that enables direct connectivity at the substrate or board level.

Below are some examples of the packages that we currently use today. There are however many other types of packages such as SSOP and SOIC that we also utilise.

System in Package

Body Size (mm)Pin Counts
2.5x312
2.5x313
3x517
3x518
5x319
3x520
5x521
3x522
4x426

QFN

Body Size (mm)QFN pin counts
0.8, 0.65, 0.5, 0.4, 0.35, 0.3 mm pitch
2 x 26/8/10/12
3x34/8/10/12/16/20/24
4x412/16/20/24/28/32/40
5x516/20/28/32/36/40/44/52
6x518/24/36/42
6x620/24/28/36/40/48/56/64
7x728/32/36/44/48/56/68/80
8x832/36/40/52/56/68/76/88
9x936/44/48/60/64/76/88/104
10x1044/52/56/68/72/88/100/116
12x1248/60/84/88/100/108/124/144

Wafer Level Chip Scale Packaging (WLCSP)

SWINDON offers, through our world renowned packaging partners, a Wafer Level CSP low cost solution that enables direct connectivity at the substrate or board level. Our partners who provide this service are equipped with latest state-of-the art Laser Mark, Laser Groove, Wafer 2D/3D inspection station and high speed Die Sorters.

SWINDON offers full turnkey solution for Wafer Level CSP which includes wafer test (probing), wafer bumping and tape and reel utilizing full wafer map integration to handle die sizes from 0.2 sq.mm to 36 sq.mm.

PackageIO CountDie Size
Printed BumpBall DropPrinted BumpBall Drop
WLCSP2-1074-150266 x 566um – 2640 x 2480um1000 x 1000um - 4909μm x 5453μm

Bespoke ASIC Design – FAQs

There are often similar concerns at the beginning of thinking about working with a custom ASIC design partner which we have answered below. If you any any questions of your own please send us an email or give us a ring.

View the FAQs

How we can help you

By partnering with SWINDON you will be receiving best in class ASIC design and supply services that will enable you to become a market leader. Utilising our experience of over 350 projects, we will deliver a solution that will give you the competitive edge, both technically and commercially.

SWINDON has in house high volume wafer probe and packaged device test facilities along with the ability to calibrate your ASIC / MEMS at test. SWINDON’s full turnkey ASIC solutions will provide you higher performance, smaller size and lower costs.

Contact SWINDON today to discover how we can help you succeed.

SWINDON Silicon Systems Limited

+44 (0) 1793 649400
sales@swindonsilicon.co.uk

Registered Office:
Interface House
Interface Business Park
Bincknoll Lane
Royal Wootton Bassett
Wiltshire, SN4 8SY, England

Registered in England and Wales
Registration Number: 01378199