ASIC Production Test

SWINDON Quality and Precision

At SWINDON Silicon Systems design and test are closely linked in order to deliver optimal analogue performance and maximum mixed signal testing efficiency. Achieving high throughput, while maintaining the high measurement accuracy demanded by Analogue and Mixed-Signal ASICs, requires substantial knowledge and expertise of commercially available Automated Test Equipment (ATE). As one of many improvements, we have reduced the test time of Devices Under Test (DUT) but also increased test coverage. This in turn minimises the final device cost but maximises performance through quality. The result is a dramatic increase in product repeatability, yield and overall test quality with a vast decrease in field failure ppm rates.

Our aim to ensure on time delivery of the ASIC test development right through from initial concept to full volume production.

  • Bench Evaluation / Characterisation of the ASIC can be initiated using the LabWindows software and various NIDAQ cards
  • In house Test PCB’s are designed using either Protel 99SE or the more recent Altium software.
  • Prototype test board designs can be quickly evaluated using an in-house routing machine.
  • During the ATE test development, Test Engineers work with direct input from the ASIC designers to achieve the best possible test coverage.
  • Probe testing can be performed using the TSK-APM90-A probers.
  • Part Average Testing can be done during wafer probe via the post process Galaxy PATMAN software.
  • ATE test equipment is used for Volume ASIC quantities; these include the Ltx Credence D10 Testers and Teradyne A312s.
  • Test Programming is conducted in DMD (C++ based) for the LtxCredence D10 testers and PASCAL STEPS for the A312 testers.
  • SWINDON has automatic test handlers capable of testing various package styles and includes quad site capability.
  • All ATE testers, probers and handlers are maintained by the highly experienced and qualified Test Engineering Department.

Importantly production yields / spreads are closely monitored to ensure the whole production process is well controlled and that any potential issues are foreseen. These are fed back to the ASIC design team so that a continual improvement process can be maintained.

    • Fully automated wafer and package level test
    • Fully automated, online test and QA procedures
    • TS 16949 accredited
    • 100% wafer level test, each device
    • 100% package level test, each package
    • Real-time yield statistics
    • Wafer and package level tests correlated
    • 100% Datalog, each device
    • Tri temperature test
    • 6" and 8” capability
    • Al pads
    • Bumped probe: Pb, Pb
    • Extended temp (Hot) Probe
    • Extensive data analysis capability
    • Fine pitch, High pin count
    • High volume production probe
    • Multi site testing
    • Probe card design, fabrication and verification
    • RF probe capability
    • N2 wafer storage
    •    
    • Wafer mapping

What our partnership approach means to you…

At SWINDON we aim to work in partnership to design and develop bespoke and unique ASIC solutions which give our customers both a technical and commercial advantage.

To discover what we can do together please get in touch for an initial exploratory discussion.

Call our sales department on +44 (0) 1793 649 400 or email us at sales@swindonsilicon.co.uk